As we reach the end of 2025, we’d like to take the opportunity to reflect on all of Universal Chiplet Interconnect Express™ (UCIe™) Consortium’s accomplishments throughout this year. It’s been a year defined by accelerating momentum, deeper industry collaboration, and meaningful progress across the chiplet ecosystem. Let’s review some of our favorite 2025 highlights as we approach the end of another busy year of chiplet innovation: 1.      We released the UCIe 3.0 Specificati

In a recent webinar , we had an amazing panel of Universal Chiplet Interconnect Express™ (UCIe™) member companies - Archana Cheruliyil from Alphawave Semi, Justin Bunnell from Siemens EDA, Manuel Mota from Synopsys, Mayank Bhatnagar from Cadence, and Vishal Chandrasekar from Ayar Labs - moderated by Brian Rea, UCIe Marketing Chair. Together, they explored how UCIe is accelerating the era of chiplet-based design through real-world collaboration, flexibility, and innovation. 

The Universal Chiplet Interconnect Express™ (UCIe™) Consortium is happy to be a part of this year’s Supercomputing 2025  event in St. Louis, Missouri from November 16-21, 2025! Be sure to stop by the Open Standards Pavilion in Booth #211  to learn more about   the UCIe 3.0 specification , which delivers significant performance gains with support for 48 GT/s and 64 GT/s data rates, along with architectural enhancements that improve bandwidth density, power efficiency, and syst

Authors: Mayank Bhatnagar (Cadence), Manuel Mota (Synopsys) and Dana Neustadter (Synopsys)   In part one of this blog, we examined how...

The semiconductor industry is undergoing a seismic shift. Traditional monolithic chip designs cannot keep pace with skyrocketing demands...

Authors: Mayank Bhatnagar (Cadence), Soheil Modirzadeh (Synopsys) and Sajani Patel (Synopsys) As the semiconductor industry accelerates...

The UCIe Consortium had a dynamic presence at this year’s Future of Memory and Storage (FMS) event , engaging attendees through important...

Authors:   Mayank Bhatnagar , Product Marketing Director, Cadence Design Systems Soheil Modirzadeh , Sr. Product & Solutions Marketing...

The Universal Chiplet Interconnect Express™ (UCIe™) Consortium made its first appearance at the Optical Fiber Communications Conference...

Author:  Mayank Bhatnagar, Product Marketing Director, Cadence Design Systems   The semiconductor industry has long been driven by the...

The semiconductor industry is experiencing new opportunities as a result of the industry’s rapid advancement of AI, creating a growing...

The semiconductor industry is on the brink of a transformative era, driven by the need for higher performance, greater efficiency, and...

Earlier this year, the UCIe™ (Universal Chiplet Interconnect Express™) Consortium established a Memorandum of Understanding (MoU) with...

By: Tim Wang-Lee, Ph.D. Signal Integrity Application Scientist at Keysight Technologies Chiplet design marks a transformative shift in...

UCIe™ Consortium member Untether AI® recently shared their thoughts on the importance of UCIe technology in AI applications as well as...

By Brian Rea, UCIe Marketing Working Group Co-Chair Last month, the UCIe™ (Universal Chiplet Interconnect Express™) Consortium was...

By Nir Sever, Senior Director of Business Development, proteanTecs UCIe™ Consortium member proteanTecs shared details on its contribution...

By: Saman Sadr, President, Neuron IP & Richard Lin, Digital Design Lead, Neuron IP The Importance of Security in Upcoming Chiplet Systems...

As we welcome in the new year, the UCIe™ Consortium Marketing Workgroup decided to take a moment to celebrate some of the amazing work...

By Lakshmikant (LK) Bhupathi, Vice President of Products, Strategy and Ecosystem, Ayar Labs UCIe Consortium member Ayar Labs provided an...