UCIe at the Future of Memory and Storage 2025

The UCIe Consortium had a dynamic presence at this year’s Future of Memory and Storage (FMS) event, engaging attendees through important announcements, active participation on the show floor, and a series of informative sessions. From unveiling the UCIe 3.0 Specification to connecting with industry professionals in both formal and informal settings, the event offered a valuable platform to share our vision for an open, interoperable chiplet ecosystem.

UCIe 3.0 Specification Announcement

UCIe opened the event with a major milestone, the release of the UCIe 3.0 Specification. This update delivers significant performance gains with support for 48 GT/s and 64 GT/s data rates, along with architectural enhancements that improve bandwidth density, power efficiency, and system-level manageability. These advancements strengthen UCIe’s position as the foundation for scalable, high-performance multi-chip System-in-Package designs. For more details, read the full release here.

To support the announcement, UCIe rolled out a coordinated set of materials, including statements of support from 20 member companies and an in-depth technical white paper. To further support the announcement, UCIe worked with member companies to amplify the 3.0 announcement on social media and highlight the benefits for their clients and the industry.

Sparking Conversations and New Connections

Ten UCIe member companies had booths on the exhibition floor, each displaying a “Proud Member” sign to show their support for the Consortium. UCIe was pleased to be part of the Open Standards Pavilion alongside other leading organizations in the industry. Open standards play a critical role in driving collaboration and helping to build a truly open chiplet ecosystem, and the Pavilion showcased how different groups are working toward that shared vision.

The UCIe kiosk quickly became a gathering spot for attendees who wanted to talk about chiplet technology and learn more about the Consortium. Many came with questions about the new UCIe 3.0 Specification and UCIe’s overall mission. UCIe also met with non-member companies curious about how they could get involved.

Demo videos from Ayar Labs, Alphawave Semi, Cadence, and Synopsys ran throughout the event, giving attendees a closer look at member solutions and products that bring UCIe to life.

Slices, Pints, and Chiplet Conversation

UCIe hosted a Chat with the Experts table during the evening networking event, giving attendees a relaxed setting to drop in, ask questions, and get answers while enjoying pizza and beer. From the first slice to last call, Brian Rea, Marketing Work Group Chair, and Gerald Pasdast, Form Factor Co-Chair, welcomed a steady flow of curious guests.

One memorable conversation came from a financial analyst eager to understand the market impact of chiplets and the growth of the UCIe ecosystem. Others stopped by for more technical discussions, including in-depth questions about the new 3.0 Specification. As the evening went on, the energy stayed high, and UCIe’s table was the last group standing.

FMS Sessions - Sharing Knowledge, Shaping the Future

Sessions are a key part of events like this, giving attendees the chance to hear directly from subject matter experts, ask questions, and learn how UCIe can be implemented into their own product designs. The presentations and panel discussions also highlighted the growing breadth of the UCIe chiplet ecosystem, with representation from memory vendors, EDA companies, and testing solution providers.

Wednesday’s session, Innovative Architectures and Emerging Opportunities: UCIe Integration and Chiplet Advancements in Mobile and AI Systems, brought together speakers from SK Hynix and Keysight Technologies alongside the UCIe Consortium. Thank you to Soojin Kim, Minsoon Hwang, and Randy White for sharing their insights. The session explored the transformative potential of modular chiplet-based design in markets like AI, mobile, and automotive, touching on high-bandwidth storage, power optimization, and advanced memory systems such as MOSAIC and M.Link. The session wrapped with a panel discussion led by Chuck Sobey discussing opportunities for chiplet-based architectures, particularly for memory and storage markets.

Thursday morning’s sponsor session, UCIe 3.0 Specification: Driving Innovation for Efficient, Scalable, and Reliable Chiplet Integrations, featured Swadesh Choudhary Protocol WG Co-Chair. Swadesh joined Brian for this session that covered the new UCIe 3.0 Specification and showed how chiplets help overcome die size constraints, enable custom solutions, and deliver the performance needed for memory and storage applications. The discussion also addressed UCIe’s role as an open standard for high-bandwidth, low-latency, power-efficient chiplet connectivity.

Later on Thursday, Navigating the Chiplet Revolution: Applying EDA Insights into UCIe Standards brought EDA perspectives from Tim Wang Lee, Himani Kaushik, and Prashant Dixit. This lively session focused on the technical challenges and opportunities in the chiplet ecosystem, with an emphasis on signal integrity, verification, and simulation-based interoperability testing to help accelerate adoption of UCIe standards.

Brian Rea was invited to join the closing panel at FMS, where he was able to emphasize the pivotal role that open standards and chiplet technology will play in driving innovation. He noted that as the industry works to meet the growing demand and accelerating pace of transformation for key workloads such as AI, the adoption of open standards like UCIe ensures interoperability, while a robust chiplet ecosystem provides the flexibility and scalability needed to advance new designs, ultimately benefiting the entire technology landscape.

The expertise and perspectives shared in these sessions not only helped educate attendees about UCIe but also demonstrated the collaborative spirit and diversity of companies involved in advancing the chiplet ecosystem.

Keeping the Conversation Going

Events like the Future of Memory and Storage are an essential part of UCIe’s mission. They provide the perfect platform to share important announcements, generate interest among press and analysts, and engage directly with the industry. These gatherings allow us to explain what UCIe is, highlight the benefits of adopting the standard, and strengthen relationships with both current and potential Consortium members.

FMS was a success thanks to the tremendous contributions of our members. From showcasing video demos of their solutions to spending time in the kiosk answering attendee questions, every effort helped raise awareness and build momentum for the UCIe ecosystem.

We are already looking ahead to our next opportunity to connect with the industry at Super Compute 2025 (Booth 211) in November.