Events
Upcoming Events
The Future of Memory and Storage (FMS) - August 4-6, 2026 | Santa Clara, CA
FMS is a multi-faceted conference experience providing the most comprehensive and technically credible memory and storage event on the planet. Presenters are visionary industry leaders, engineers and architects from all disciplines. They are selected for their relevance, dynamism and insight.
The UCIe Consortium will be a sponsor of FMS this year and will be speaking on the Industry Association track on Thursday, August 6, 2026 at 9:45am. Stay tuned for more information about speaker abstracts and additional activities.
Register for the event HERE.
AI Infra Summit - September 15-17, 2026 | Santa Clara, CA
The UCIe Consortium is looking forward to having a kiosk in the Open Standards Pavilion to promote the benefits of UCIe for AI applications. Attendees can expect:
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A totally unique cross section of the AI Market: Meet data scientists and model builders, plus hardware & systems architects, roboticists, and data center professionals under one roof
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Mainstage · Compute · Data Movement · Physical AI · AI Data Centers · Data & Models – Six specialized tracks covering every conceivable critical engineering domain in AI infrastructure.
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Product Launches, Visionaries & Mind-Blowing Breakthroughs. Hear industry news first hand from the stage that has launched products from companies including NVIDIA, Intel, Qualcomm, Habana Labs and many more…
Register for the event HERE.
SC26 - November 15-20, 2026 | Chicago, IL
SC26 is where the HPC community comes together to make technological and research progress, enlighten and empower all people, eliminate barriers to opportunities, and chart the course for computing’s impact in the world.
Stay tuned for more information of UCIe Consortium's participation.
Past Events
IMAPS Device Packaging Conference - March 2-5, 2026 | Phoenix, AZ
The UCIe Consortium hosted a Poster Session at the IMAPS Device Packaging Conference in Phoenix, Arizona.
IMAPS is the premier, non-profit membership association steering the communities associated with Microelectronics Advanced Packaging, Interconnect and Assembly by providing channels for communicating, educating, and interacting within academia, industry and government.
Chiplet Summit - February 17-19, 2026 | Santa Clara, CA
The UCIe Consortium sponsored the "Applying Die-to-Die Interfaces" tutorial session, organized and moderated by Brian Rea, UCIe Consortium Marketing Working Group Chair. Industry leaders from Intel and Google provided practical guidance on UCIe fundamentals, protocol and logical layer design considerations, interoperability, manageability, and security.
On the show floor, Intel and Cadence showcased the industry's first live UCIe-S interoperability demonstration using the "Cameron Creek" test chip. More information on UCIe's experience at Chiplet Summit can be found in our recap blog HERE.
