Electronic Circuit Board

About UCIe™

UCIe™ (Universal Chiplet Interconnect Express™) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

 

AMD, Arm, Advanced Semiconductor Engineering, Inc. (ASE), Google Cloud, Intel Corporation, Meta, Microsoft, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company are dedicated to this open industry standard organization to promote and further develop the technology, and to establish a global ecosystem supporting chiplet design.   

INITIAL FOCUS

  • Physical Layer: Die-to-Die I/O with industry leading KPIs

  • Protocol: CXL/PCIe for near-term volume attach

  • Well-defined specification: ensure interoperability & evolution

FUTURE GOALS

  • Additional protocols

  • Advanced chiplet form-factors 

  • Chiplet management

  • And much more!