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Electronic Circuit Board

About UCIe™

UCIe™ (Universal Chiplet Interconnect Express™) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

 

Board members Alibaba, AMD, Arm, Advanced Semiconductor Engineering, Inc. (ASE), Google Cloud, Intel Corporation, Meta, Microsoft, NVIDIA, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company along with our extensive Contributor and Promoter membership, are dedicated to this open industry standard organization and promoting and further development of the technology. Together we are establishing a robust global ecosystem to support chiplet design.   

INITIAL FOCUS

  • Physical Layer: Die-to-Die I/O with industry leading KPIs

  • Protocol: CXL/PCIe for near-term volume attach

  • Well-defined specification: ensure interoperability & evolution

FUTURE GOALS

  • Additional protocols

  • Advanced chiplet form-factors 

  • Chiplet management

  • And much more!

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