In the News

• A New Revolution in AI Computing Architecture: UCIe High-Speed Chiplet - Communication Components Magazine / December 5, 2025

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• Chiplet Integration and Testing: Key Lessons For Next-Gen Semiconductor Packaging - Semiconductor Engineering / November 20, 2025

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• On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach - Chiplet Marketplace / October 10, 2025

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• Chiplet Technology Explained: Revolutionizing Semiconductor Design in 2025 - Tech Announcer / October 8, 2025

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• Why The Next Breakthrough In Chips Depends On Rethinking Design Workflows - Semionductor Engineering / October 6, 2025

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• Chiplets: Reducing Costs and Accelerating Chip Design - Electropages / October 2, 2025

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• UCIe 3.0 Adds DSP Support - EE Times / September 24, 2025

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• Making Connections: The Pursuit of Chiplet Interconnect Standardization - Data Center Dynamics / September 18, 2025

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• UCIe, Marvell Memory And Rapidus 2nm Fab at the Hot Chips Conference - Forbes / September 3, 2025

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• Semiconductor Chiplets Become Twice as Fast...UCIe 3.0 Standard Announced - ET News / August 11, 2025

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• UCIe 3.0 Doubles Bandwidth, Expands Chiplet Ecosystem - Intel's Das Sharma on AI and Compatibility - Digitimes Asia / August 11, 2025

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• UCIe 3.0 Doubles Data Rate For 2D Chiplets - EE Times / August 8, 2025

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• UCI Express Cranks Up Chiplet Interconnect Speeds - The Next Platform / August 8, 2025

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• The Universal Chip Interconnect (UCIe) has released the UCIe 3.0 specification, which supports 48GT/s and 64GT/s speeds - Cool3c / August 7, 2025

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• UCIe 3.0 Spec Released with Big Speed Up for Chiplets - Serve The Home / August 5, 2025

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• Accelerate AI Chip Development with 3D Multi-Die Designs - Electronic Design / March 7, 2025

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• Why UCIe is Key to Connectivity for Next-Gen AI Chiplets - EE Times / February 6, 2025

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• IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3 - 3DInCities / January 28, 2025

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• Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced Packaging Technology - Semiconductor Engineering / January 23, 2025

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• 3 Key Takeaways from Chiplet Summit 2025  - Tech Arena / January 23, 2025

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• The promise and peril of chiplets for IoT  - RCR Wireless / October 3, 2024

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• Chiplet Standard Goes 3D - EE Times / September 9, 2024

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• UCIe 2.0 for 3D Chip Structures Offers up to 75 Times More Bandwidth Than Predecessor Spec - HPCwire / August 16, 2024

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• UCIe in 3D - Electronic Design / August 13, 2024

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• UCIe 2.0 specifications standardize management architecture and 3D packaging across different chiplets - Tom's Hardware / August 7, 2024

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• Fresh NVMe 2.1 and UCIe 20. specifications arrive for modern storage and chiplets - Techspot / August 7, 2024

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• Does This Chip Hold the Future of the Semiconductor Industry? - Electronic Design / April 3, 2024

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• Interconnects Essential To Heterogeneous Integration - Semiconductor Engineering / March 28, 2024

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• Packaging Chiplets for Performance and Profit - Electronic Design / March 20, 2024

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• Chiplets are the latest buzz, but many challenges lie ahead - Embedded / March 10, 2024

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• How does UCIe on chiplets enable optical interconnects in data centers? - Connector Tips / March 8, 2024

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• UCIe Goes Back To The Drawing Board - Semiconductor Engineering / February 22, 2024

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• Why Chiplets Are So Critical In Automotive - Semiconductor Engineering / February 20, 2024

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• High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express - Nature Electronics / February 2024
   

• Chiplets: 10 Breakthrough Technologies 2024 - MIT Technology Review / January 2024
   

• Universal Chiplet Interconnect Express: An Open Industry Standard for Memory and Storage Applications - IEEE Computer / January 2024

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• @HPCpodcast: Tech Analyst Adrian Cockcroft on Trends Driving Future HPC Architectures - InsideHPC / November 30, 2023

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• SC23: TOP500 Trends, the AI-HPC Crossover, Chiplet Standardization, the Emergence of UCIe and CXL Advancements - InsideHPC / November 29, 2023

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• How the Worlds of Chiplets and Packaging Intertwine - EE Times / September 26, 2023 

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• Eight things we learned from Intel's Innovation keynote - The Verge / September 21, 2023 

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• Standardization and Integration of Chiplets Using UCIe with Brian Rea - Gestalt IT / September 1, 2023 
   

• UCIe 1.1 Specs Announced for Chiplet Future - ServeTheHome / August 18, 2023 
   

• Enabling A Chiplet Supply Chain - Semiconductor Engineering / August 17, 2023
   

• UCIe 1.1 Brings Chip Level Connectivity Out Of The Box - Forbes / August 10, 2023
   

• UCIe sees automotive chiplet group with latest specification - eeNews Automotive / August 9, 2023 
   

• An OSAT Perspective On Semiconductor Market Trends - Semiconductor Engineering / January 19, 2023 
   

• Standardizing Chiplet Interconnects - Semiconductor Engineering / May 23, 2022

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• Building a Chiplet Ecosystem - Electronic Design / March 10, 2022

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• New UCIe Chiplet Standard Supported by Intel, AMD, and Arm - Tom's Hardware / March 2, 2022

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• Universal Chiplet Interconnect Express (UCIe) Announced: Setting Standards For The Chiplet Ecosystem - AnandTech / March 2, 2022

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• A new standard could let companies build processors out of Lego-like chiplets - The Verge / March 2, 2022

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• Universal Chiplet Interconnect Express UCIe 1.0 Launched - Serve The Home / March 2, 2022

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• UCIe Launch Enables Chiplet On-Package Integration - Forbes / March 2, 2022

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• Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard - HPC Wire /
  March 2, 2022

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• The future of processor technology could see AMD, Intel, & Arm all share a common connection - PC Gamer / March 2, 2022

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• Chip industry standardizes on UCIe chiplet ecosystem for interoperability - Venture Beat / March 2, 2022

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• Intel, AMD, Arm And Other Semiconductor Giants Back A Universal Chiplet Interconnect Standard - Hot Hardware / March 2, 2022

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