Press Releases 

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• UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification

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• UCIe™ 1.1 Statements of Support

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• UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership - Beaverton, OR, USA / August 2, 2022

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• UCIe™ Consortium Board Statements of Support

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• Leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers join forces to standardize chiplet ecosystem - Beaverton, OR, USA / March 2, 2022