Don’t Miss UCIe Consortium at Supercomputing 2025
- UCIe Marketing
- 1 day ago
- 2 min read
The Universal Chiplet Interconnect Express™ (UCIe™) Consortium is happy to be a part of this year’s Supercomputing 2025 event in St. Louis, Missouri from November 16-21, 2025! Be sure to stop by the Open Standards Pavilion in Booth #211 to learn more about the UCIe 3.0 specification, which delivers significant performance gains with support for 48 GT/s and 64 GT/s data rates, along with architectural enhancements that improve bandwidth density, power efficiency, and system-level manageability.
The demand for scalable performance in high-performance computing continues to push the limits of what’s possible in silicon integration. As workloads evolve, from AI training clusters to advanced scientific modeling, chiplet-based architectures have become the preferred path forward, enabling modular designs that can integrate diverse process technologies within a single package. UCIe is central to this transformation, providing an open and unified framework that allows chiplets from multiple vendors to communicate seamlessly and predictably, all while maintaining interoperability and design flexibility.
The new UCIe 3.0 specification represents a key milestone in this journey. Beyond faster data rates and improved efficiency, it introduces capabilities designed for the next era of HPC innovation: continuous transmission protocols for low-latency workloads, advanced power management features for energy-conscious systems, and enhanced link management for reliability across large, multi-chiplet configurations.
At SC25, you will have the opportunity to connect directly with UCIe Consortium members who are implementing these technologies in real-world applications. Learn how UCIe is enabling faster innovation cycles, reducing design challenges, and fostering an open ecosystem that supports collaboration across the industry.
In addition to our own presence at SC25, we also have many members onsite who will be actively discussing their contributions to the UCIe chiplet ecosystem. Learn more about some of our members UCIe-related activities below:
If you’re designing next-generation computing platforms, developing your own chiplets, or simply exploring how to integrate with the growing chiplet ecosystem, now is the perfect time to get involved. Visit us at Booth #211 to meet our members, see demonstrations, and discover how UCIe can help you accelerate your design roadmap and become part of a rapidly expanding community shaping the future of advanced packaging.
