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UCIe Consortium Showcases Chiplet Innovation at OFC 2025

  • UCIe Marketing
  • Apr 30
  • 3 min read

The Universal Chiplet Interconnect Express™ (UCIe™) Consortium made its first appearance at the Optical Fiber Communications Conference and Exhibition (OFC) this year at a dedicated UCIe Kiosk hosted in the Ayar Labs booth. UCIe Consortium would like to thank Ayar Labs for their generous support in making this collaboration a success!

 

The kiosk featured several UCIe member companies: Ayar Labs, Alphawave Semi, Neuron IP, and Keysight—who came together to highlight the growing importance of UCIe and how it’s enabling a new generation of open, interoperable chiplet-based systems.

 

Engaging with the OFC Community

The UCIe Kiosk was designed to engage directly with OFC attendees who are interested in how chiplets can play a role in the future of quantum networking, artificial intelligence (AI), and data center design. This is especially important in data centers, where speed, power efficiency, and customization are critical as we bring more complex optical and photonics technologies into the mix.

 

We were delighted by the amount of booth traffic and thoughtful conversations around how UCIe can reduce costs, speed up development, and support system designs that go beyond traditional chip size limits. Visitors could also access educational materials featuring:

 

  • Quotes from participating members about the value of UCIe

  • A full list of UCIe Consortium members present at OFC

  • Information on how UCIe is standardizing today’s chiplet ecosystem and preparing for future generations

 

Key Benefits of UCIe Technology

At the UCIe Kiosk, member companies emphasized how UCIe is addressing some of the pressing challenges in chiplet-based design. As co-packaged optics provide a compelling solution to addressing the massive bandwidth and low latency needs of AI and high-performance computing, UCIe serves as the ideal interface for connecting chips to optical systems, facilitating seamless integration and enhancing power efficiency.  

 

Attendees could hear about the value of a standardized interconnect that enables easier integration of chiplets across vendors and technologies which help unlock SoC designs that go beyond reticle limits without the traditional complexity. By aligning on a common spec, UCIe reduces time-to-solution, cuts development costs, and accelerates the path from prototype to production.

 

Members also highlighted how UCIe technology supports a more open, scalable ecosystem by enabling interoperability across process nodes and manufacturing partners. This flexibility allows for more targeted, customizable designs while preserving reuse and reducing portfolio overhead. For many, the UCIe specification represents the foundation for a true chiplet marketplace, where innovation can flourish without being bottlenecked by proprietary interfaces or integration barriers.

 

Member News and Ecosystem Growth

In addition to the UCIe Kiosk, several members used OFC as a platform to announce exciting news related to UCIe technology development. We were pleased to help amplify those updates and share how the ecosystem continues to grow. Check out the announcements from Ayar Labs, and Lightmatter.


Looking Ahead: A Growing Presence at Industry Events

The hosted kiosk model is proving to be a powerful way for the UCIe Consortium to show up at important events like OFC, engage directly with new audiences, and spread the word about the benefits of UCIe technology. We look forward to finding new ways to support our membership’s onsite event activities and we invite other members to join us at future industry events to continue building awareness and momentum around UCIe.

 

Stay tuned as the UCIe Consortium continues to drive innovation and collaboration across the chiplet ecosystem.

 
 
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