UCIe™ Consortium's 2025 Year in Review
- UCIe Marketing
- 2 days ago
- 3 min read
As we reach the end of 2025, we’d like to take the opportunity to reflect on all of Universal Chiplet Interconnect Express™ (UCIe™) Consortium’s accomplishments throughout this year. It’s been a year defined by accelerating momentum, deeper industry collaboration, and meaningful progress across the chiplet ecosystem. Let’s review some of our favorite 2025 highlights as we approach the end of another busy year of chiplet innovation:
The UCIe 3.0 specification delivers significant performance enhancements, most notably support for 48 GT/s and 64 GT/s data rates, alongside architectural updates to meet growing industry demand for high-speed, interoperable chiplet solutions. These advancements improve bandwidth density, power efficiency, and system-level manageability, key enablers for scalable multi-chip System-in-Package (SiP) designs to accelerate innovation in modular semiconductor design.
To dive deeper into the new features and benefits, explore our “UCIe 3.0 Specification: Driving Innovation for Efficient, Scalable, and Reliable Chiplet Integration” whitepaper.
This blog series brings together multiple experts from across UCIe Consortium member companies, to explain why the industry is moving beyond monolithic designs, what challenges must be addressed in chiplet architectures, and how an open specification enables a thriving, interoperable ecosystem. By breaking down topics such as the value of open standards, signal integrity and power delivery, and UCIe latency and security, we’re helping engineers and architects understand what’s at stake as chiplet adoption accelerates.
The series explores key topics such as “Introduction to Chiplets”, “The Value of an Open Specification”, “Signal Integrity and Power Delivery”, and “UCIe Latency and Security”. Through this educational series, UCIe Consortium seeks to not only provide clarity on complex design considerations but also demonstrate the critical role our standard plays in enabling scalable, high-performance chiplet integration across the industry.
3. UCIe participated in nine major industry events.
UCIe was actively engaged at events this year, participating in Chiplet Summit, IMAPS Device Packaging, Optical Fiber Communication (OFC) Conference, CadenceLIVE, Future of Memory and Storage (FMS), Hot Interconnects, Embedded World North America, IEEE International Test Conference, and Supercomputing — bringing our work directly to the engineers, innovators, and decision-makers shaping the future of semiconductor design. Participating in these events helped to showcase the future of UCIe technology and highlight how our members are already actively implementing UCIe chiplet solutions. By engaging across this variety of event audiences and market segments, we showcased the next wave of UCIe technology while continuing to amplify member demos, supporting our member’s presence at additional industry and automotive events, and strengthening awareness of the growing chiplet ecosystem.
Where our members are innovating, UCIe Consortium is right alongside them championing their progress, deepening collaboration, and accelerating industrywide adoption of open, interoperable chiplet solutions.
4. Elevating industry knowledge through high-impact educational webinars. UCIe hosted two educational webinars this year, “Introducing the UCIe™ 3.0 Specification: Continued Innovations in the Open Chiplet Ecosystem” and “The Growing Chiplet Ecosystem: Collaboration, Innovation, and the Next Wave of UCIe™ Adoption”. These sessions brought engineers, architects, and technology leaders together to explore how chiplets are redefining advanced system design, and how the UCIe specification is uniting the industry around a common, interoperable future.
In these webinars, consortium experts highlighted UCIe 3.0’s doubled data rates, new manageability and power-efficiency features, expanded SiP design flexibility, and real-world collaborations driving adoption across applications from high-bandwidth memory to optical interconnects. Attendees gained an inside look at how member companies are implementing UCIe solutions in this moment and what innovations are coming next to make chiplet integration more flexible, scalable, and future-ready.
To view our previous webinars and see updates on upcoming webinars, visit our webinars webpage and subscribe to the UCIe Consortium YouTube channel.
We extend a special thank you to our members whose contributions to UCIe specification development and ecosystem advancement made 2025 another successful year. As we look ahead to 2026, we’re excited to continue this momentum with our sponsorship of Chiplet Summit 2026, continued collaboration across the expanding chiplet ecosystem, and the continued development of UCIe 3.0 specification educational materials to support broader industry adoption of UCIe-based chiplet architectures. Together, we’re shaping the future of open and interoperable chiplet integration, one member innovation at a time.
