UCIe® Draws Strong Interest at FMS 2026

The UCIe® Consortium had a fantastic week at FMS 2026 in Santa Clara, with strong interest from attendees throughout the event. From conversations at the UCIe Consortium kiosk in the Open Standards Pavilion to our sponsored session and participation in Chat With the Experts, it was exciting to see growing enthusiasm for UCIe and the expanding chiplet ecosystem.

One of the highlights was our sponsored session, UCIe 3.0: The Inflection Point for Scalable Chiplet Architectures, presented by Gerald Pasdast of Intel. The session explored the evolution of UCIe across three generations and how UCIe 3.0 advances an open, standardized interconnect for interoperable, high-performance die-to-die connectivity. It also highlighted how UCIe can provide system designers with greater flexibility to integrate dies from different sources and technologies while supporting increasingly scalable chiplet architectures. To all those who attended, and especially those that asked great questions – Thank You!

We were also honored to see the UCIe 3.0 Specification named a finalist for the FMS Best in Show Award in the Connectivity category, which recognizes the pivotal role of industry-standard protocols and interfaces in creating cohesive, interoperable ecosystems. The recognition is a testament to the work of UCIe Consortium members and the collective effort behind developing an open specification designed to advance interoperability across the chiplet ecosystem. Congratulations to the CXL Consortium on being selected as this year’s Connectivity Award winner!

Attendees also had the opportunity to view video demonstrations from UCIe member companies Cadence, Rebellions, and Synopsys. Real-world demonstrations are an important part of showing how the UCIe ecosystem is progressing beyond specifications and into practical implementation, giving the industry a closer look at the technologies, tools, and solutions being developed around the standard. We are grateful to our members for supporting the UCIe Consortium’s ongoing ecosystem education efforts and helping bring these capabilities to life. You can watch the demos on our YouTube Channel here.

Interest in UCIe was also especially strong following SK hynix’s HBF announcement, which prompted additional conversations around memory, chiplets, and the role of standardized die-to-die connectivity in enabling new system architectures.

A big thank you to Richard Lin of Neuron IP, Kevin Yee of Samsung, Soheil Modirzadeh of Synopsys, and Gerald Pasdast and Joe Wu of Intel for helping make FMS such a successful event and for spending time engaging with attendees throughout the week.

The momentum continues! Join UCIe at the AI Infra Summit to hear more about the latest developments across the UCIe ecosystem.