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  • Brian Rea

UCIe™ Consortium engages with the HPC Community at Supercomputing (SC’22)

By: Brian Rea, UCIe Consortium Marketing Work Group Chair, and Technology Initiative and Ecosystem Enablement Manager, Intel

The UCIe™ Consortium had the opportunity to participate in the SNIA Open Standards Pavilion at Supercomputing 2022 (SC’22) from November 14 – 17 in Dallas, Texas. A special thanks to everyone who stopped by our kiosk to learn more about UCIe (Universal Chiplet Interconnect Express™) – an open industry standard that defines the interconnect between chiplets within a package.

It was great to hear how suppliers and end users are excited about the potential to deliver architectural innovations using chiplets, and the rapid growth in UCIe membership was seen as a testament to the interest in developing a robust open ecosystem. I also enjoyed discussions with students who were inspired to think about possibilities to conduct research related to chiplet based architectures.

UCIe Consortium member companies showcased their support of the emerging UCIe ecosystem, displaying our “proud member” signs within their booths and sharing presentations throughout the show. UCIe Consortium member Mark Wade from Ayar Labs participated in a panel titled, “Transforming the Future of HPC with Silicon Photonics” where the UCIe standard was shown to be a key to the future of optical interconnects at scale. I had the opportunity to share the benefits of UCIe at the Intel theater and appreciated active audience participation in Q&A.

Looking forward to the new year, UCIe and our member companies will continue to present at industry events to promote UCIe technology and recruit more contributors to help us on our mission to establish a ubiquitous chiplet interconnect.

Interested in learning more about UCIe?

UCIe Consortium President Cheolmin Park is presenting a keynote titled “UCIe™: Building an Open Ecosystem of Chiplets for On-package Innovations” at NEPCON Japan on January 25, 2023, at 1 p.m. JST. UCIe Consortium is also participating as an organizational sponsor of the inaugural Chiplet Summit taking place from January 24- 26, 2023, in San Jose, California. Stay tuned for more information about our upcoming presentations by following UCIe on Twitter and LinkedIn.


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