The UCIe open industry standard interconnect offers high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets. It addresses the projected growing demands of compute, memory, storage, and connectivity across the entire compute continuum spanning cloud, edge, enterprise, 5G, automotive, high-performance computing, and hand-held segments.
UCIe Consortium representatives will be attending Supercomputing 2023 (SC’23) at the Colorado Convention Center in Denver from November 14 – 17 to share how UCIe is well poised to enable innovations in the ecosystem to address the challenges that the supercomputing community is facing today.
Visit the UCIe Consortium kiosk at SNIA’s “Open Standards Pavilion” located in booth #1403 during the event to meet with UCIe experts and learn more about UCIe technology.
Contact press@uciexpress.org to schedule a meeting with UCIe representatives at SC’23!
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