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  • Brian Rea

UCIe™ Consortium Returns as an Organizational Sponsor of Chiplet Summit 2024

By Brian Rea, UCIe Marketing Working Group Co-Chair  

 

Last month, the UCIe™ (Universal Chiplet Interconnect Express™) Consortium was excited to return to the Chiplet Summit 2024 as an event organizational sponsor to introduce the new features in the UCIe 1.1 specification and highlight how UCIe enables an open chiplet ecosystem at the package level.

 

During the summit, UCIe Consortium Form Factor and Compliance Workgroup Co-Chair Gerald Pasdast presented a pre-conference tutorial titled “UCIe: A Progress Report for 2024” to highlight the developments in the UCIe specification and ongoing work of the UCIe Consortium working group. UCIe Consortium Marketing Workgroup Co-Chair Brian Rea also hosted a special presentation titled “Enabling an Open Chiplet Ecosystem at the Package Level” highlighting the benefits of UCIe technology. Additionally, UCIe Consortium member companies shared their insights about UCIe in their talks and panel discussions throughout the event. 



Building chiplets is an emerging concept, with many examples of products in the market, and UCIe technology is helping to address challenges that need to be solved to continue to grow the ecosystem.  During the event, we had the opportunity to engage in discussions of how, beyond the physical layer, our members are working to address full stack solutions that include plans for interoperability and compliance testing through the UCIe specification.

 

As we celebrate our second year of incorporation, we were also excited to see working UCIe PHY demos on the Chiplet Summit show floor from member companies Alphawave Semi, Cadence, and Synopsys.



We were pleased to see the innovative solutions that UCIe Consortium members are creating this year and look forward to hearing additional updates throughout the year. Follow the UCIe Consortium on LinkedIn to stay up to date on the latest UCIe news.

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