top of page
Electronic Circuit Board


Universal Chiplet Interconnect Express™

Building an open ecosystem of chiplets

for on-package innovations

  • Twitter
  • LinkedIn
Our Services

Announcing UCIe™ 1.1 Specification Release! LEARN MORE

UCIe™ — Universal Chiplet Interconnect Express™ — addresses customer requests for a more customizable, package-level integration — combining best-in-class die-to-die interconnect and protocol connections from an interoperable, multi-vendor ecosystem. 


This new open industry standard establishes a universal interconnect at the package-level.



COMING SOON UCIe Specification 1.0

JOIN US become a member of UCIe today
DOWNLOAD the UCIe white paper
a UCIe Specification
VIEW all current and previous UCIe member events

Contact Us

For more information on UCIe™ or to learn how to get involved, please complete the following form or contact

Thanks for submitting!

A team member will be in touch soon.

bottom of page