UCIe™

Universal Chiplet Interconnect Express™

Building an open ecosystem of chiplets

for on-package innovations

UCIe™ — Universal Chiplet Interconnect Express™ — addresses customer requests for a more customizable, package-level integration — combining best-in-class die-to-die interconnect and protocol connections from an interoperable, multi-vendor ecosystem.

This new open industry standard establishes a universal interconnect at the package-level.