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Electronic Circuit Board


The UCIe™ 1.0 Specification is an open industry standard developed to establish a ubiquitous interconnect at the package level and covers the die-to-die I/O physical layer, Die-to-Die protocols, and software stack which leverage the well-established PCI Express® (PCIe®) and Compute Express Link™ (CXL™) industry standards. The specification is available by request.

UCIe 1.0 Specification 

​The UCIe specification details the complete standardized Die-to-Die interconnect with physical layer, protocol stack, software model, and compliance testing that will enable end users to easily mix and match chiplet components from a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC.  ​

In-Standard & Advanced Package Benefits

  • Enables construction of SoCs that exceed maximum reticle size

  • Reduces time-to-solution 

  • Lowers portfolio cost (product & project)

  • Enables a customizable, standard-based product for specific use cases 

  • Scales innovation (manufacturing and process locked IPs) 

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