The UCIe™ 1.0 Specification is an open industry standard developed to establish a ubiquitous interconnect at the package level and covers the die-to-die I/O physical layer, Die-to-Die protocols, and software stack which leverage the well-established PCI Express® (PCIe®) and Compute Express Link™ (CXL™) industry standards. The specification is available by request.
UCIe 1.0 Specification
The UCIe specification details the complete standardized Die-to-Die interconnect with physical layer, protocol stack, software model, and compliance testing that will enable end users to easily mix and match chiplet components from a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC.
In-Standard & Advanced Package Benefits
Enables construction of SoCs that exceed maximum reticle size
Lowers portfolio cost (product & project)
Enables a customizable, standard-based product for specific use cases
Scales innovation (manufacturing and process locked IPs)